The product is easy to apply and cold applied, meaning no additional heating is required during the process.
It provides good adhesion on most common building substrates for a reliable bond.
The emulsion is VOC free, ensuring there are no health or environmental hazards during use.
It is VOC less, making it safe to apply in poorly ventilated or confined areas without discomfort or risk.
The material is highly thixotropic, alLowing it to be applied at high thickness on vertical surfaces without any sag or fLow.
It offers good resistance to common soil chemicals such as chlorides and sulphates, protecting the structure underground.
| Properties | Value |
|---|---|
| Density @ 25°C (ASTM D 1475) | 1.01 ± 0.02 kg/L |
| Solid content(ASTM D 2939) | 32±5 % approx. |
| Application conditions | Substrate temp. +5°C to 50°C |
| Drying time@ 25°C | 2-4 hours |
| Service temperature | -5°C + 85°C |