SmartCare Epoxy Bond EP

Key Features

• Damp and Wet Substrate Compatibility: The product can be applied on to dry or damp substrates and is suitable for use where the substrate is likely to remain permanently damp or wet.
• High Mechanical Strength: It exhibits high mechanical strength to ensure a robust and durable bond for structural applications.
• High Chemical Resistance: The formulation provides high chemical resistance and is resistant to chemical attack.
• Positive Adhesion: The product features positive adhesion that exceeds the tensile strength of the host concrete.
• Solvent-Free Formulation: It is solvent-free, making it safe for use in enclosed locations.
• Non-Shrink Properties: The material is non-shrink, ensuring that the bond remains stable and full without pulling away from surfaces